SISPAD 2026

The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.

In 2026, SISPAD was held in Kumamoto (Japan) and Marco Pala presented the original contribution "Engineering of n-type Metal-TMD Contacts via Ferroelectric Polarization: an Ab-initio Transport
Study". Moreover, Prof. M. Pala also gave the invited presentation "Ab initio Transport in 2D Materials Heterojunction Devices" at the satellite workshop "Back to Fundamentals: Semiconductor Process and Transport Simulation".